Okoroanyanwu, Chemistry and Lithography, 2 nd ed., Vol. Medeiros, “Photoresist compositions comprising norbornene derivative polymers with acid labile groups” US Patent 6,103,445 (2000)ģ. Okoroanyanwu, “Interconnect structure with low k dielectric materials and method of making the same with single and dual damascene techniques” US Patent 6,127,089 (2000)ġ. Subramanian, “Interconnect structure with silicon containing alicyclic polymers and low-k dielectric materials and method of making same with single and dual damascene techniques” US Patent 6,475,904 (2002)Ģ. Okoroanyanwu, “Process for reducing critical dimensions of contact holes, vias, and trench structures in integrated circuits” US Patent 6,518,175 (2003)ģ. Yang, “Process for preventing deformation of patterned photoresist features” US. Okoroanyanwu, “Process for reducing the pitch of contact holes, vias, and trench structures in integrated circuits” US Patent 6,589,713 (2003)ĥ. Yang, “Process for forming sub-lithographic photoresist features by modification of the photoresist surface” US Patent 6,630,288 (2003)Ħ. Shields, “Process for reducing the critical dimensions of integrated circuit device features” US Patent 6,653,231 (2003)ħ.
Okoroanyanwu, “Selective photoresist hardening to facilitate lateral trimming” US Patent 6,716,571 (2004)Ĩ. Hui, “Method(s) facilitating formation of memory cell(s) and patterned conductive” US Patent 6,753,247 (2004)ĩ. Bottelli, “Self-aligned pattern formation using wavelengths” US Patent 6,764,808 (2004)ġ0.
Okoroanyanwu, “Materials and methods for sub-lithographic patterning of contact, via, and trench structures in integrated circuit devices” US Patent 6,767,693 (2004)ġ1. Acheta “SEM inspection and analysis of patterned photoresist features” US Patent 6,774,365 (2004)ġ2. Oglesby, “Polymer memory device formed in via opening” US Patent 6,787,458 (2004)ġ3. Kim, “Two mask photoresist exposure pattern for dense and isolated regions” US Patent 6,803,178 (2004)ġ4. Okoroanyanwu, “Process for improving the etch stability of ultra-thin photoresist” US Patent 6,815,359(2004)ġ5. Tripsas “Self-assembly of conducting polymer for formation of polymer memory cell” US Patent 6,852,586 (2005).ġ6. Van Buskirk “Stacked organic memory devices and methods of operating and fabricating” US Patent 6,870,183 (2005)ġ7. Acheta “Materials and methods for sublithographic patterning of gate structures in integrated circuit devices” US Patent 6,884,735 (2005)ġ8. Buynoski, “CuS formation by anodic sulfide passivation of copper surface” US Patent 6,893,895 (2005)ġ9. VanBuskirk, “Stacked organic memory devices and methods of operating and fabricating” US Patent 6,979,837 (2005)Ģ1. Yudanov “Dielectric pattern formation for organic electronic devices” US Patent 7,012,013 (2006)Ģ2. Okoroanyanwu, “Method for patterning electrically conducting poly(phenyl acetylene) and poly(diphenyl acetylene),” U.S.
Kim Hung-Eli, “Two mask photoresist exposure pattern for dense and isolated regions” US Patent 7,368,225 (2008)Ģ4. VanBuskirk, “Stacked organic memory devices and methods of operating and fabricating” US Patent 7,465,956 (2008)Ģ5. Kim, “EUV pellicle and method for fabricating semiconductor dies using same,” U. Wirtz, “Fluorine-passivated reticles for use in lithography and method for fabricating the same” U. VanBuskirk, “Stacked organic memory devices and methods of operating and fabricating” US Patent 8,003,436 (2011)Ģ8. Okoroanyanwu, “Processing a copolymer to form a memory cell” US Patent 8,012,673 (2011)Ģ9. Pangrle, N.H. Tripsas, “Semiconductor device built on plastic substrate” US Patent 8,044,387 (2011)ģ0. Wallow, “Method for forming a high resolution resist pattern on a semiconductor wafer” U.S.
Wallow, “Method for producing a high resolution resist pattern on a semiconductor wafer” U.S. Okoroanyanwu, “Optical polarizer with nanotube array,” U.S. Okoroanyanwu, “Method for forming a photoresist pattern on a semiconductor wafer using oxidation-based catalysis,” U.S. Mangat, “Mask structures and methods of manufacturing,” U.S.
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